AI and HPC workloads demand more than legacy cooling. Discover how cabinet-integrated solutions help you scale with confidence.

AI and high-performance computing (HPC) are driving unprecedented heat loads inside the data center. Traditional cooling methods can’t keep up. To stay ahead, you need cabinet-integrated solutions that maximize efficiency, scale seamlessly, and protect critical workloads.

Key Value Points

Cabinet-first strategy – Make the rack an active part of your thermal backbone
Airflow control – Reduce hotspots and energy waste with precision airflow management
Physics-driven innovation – Harness Bernoulli’s principle & Venturi effect for passive cooling
Hybrid air + liquid cooling – Target chip-level heat loads without disruptive retrofits
Proven in the field – University of Chicago achieved 37% energy savings & eliminated throttling

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